SCHOTT offers the broadest portfolio of glass wafers

SCHOTT’s thin and ultra-thin glass wafers and substrates are made of different materials in sizes up to 12˝ with different surface qualities and customized features. Photo: SCHOTT

The specialty glass expert will present its material and technology expertise at the ECTC. 

The special glass expert SCHOTT is one of the leading suppliers of thin and ultra-thin glass wafers and sheets for the semiconductor and optoelectronics industries meeting the industry standard requirements. At the international Electronic Components and Technology Conference (ECTC) from May 31 – June 6 in Las Vegas, SCHOTT will be presenting a variety of examples of products based on different materials and processing technologies (Booth 220). With its high-quality wafers and substrates, SCHOTT serves emerging industry trends in the fields of IC packaging, radio frequency (RF) components and micro-electromechanical systems (MEMS). 

Based on its more than 130 years of experience in developing and manufacturing specialty glass, SCHOTT has the broadest portfolio of glass wafers and substrates. The wide range results from various materials that are known for their different chemical and thermomechanical properties and surface qualities. The wafers and substrates, produced with proprietary processes, are available in different sizes (wafer diameters up to 12˝; sheet sizes up to 510 x 510 mm2) and thicknesses (from 1.1 mm down to ultra-thin 25 µm). Additionally, SCHOTT offers extensive application support in the field of handling technologies and formation of glass wafers with “Through Glass Vias” (TGV) covering a wide spectrum of feature sizes.

“Thanks to our broad range of materials and processing capabilities, we are able to offer our customers made-to-measure solutions with customized features. In this way we support emerging "More-than-Moore" industry trends, for example in consumer electronics, high-performance computing or autonomous driving, cost efficiently enabling high performance levels for the end user,” explains Dr. Rüdiger Sprengard, Director New Business Ultra-Thin Glass at SCHOTT AG.

State-of-the-art processing capabilities

SCHOTT not only works continuously on expanding its portfolio of materials for the electronics industry, but also on the optimization and expansion of processing technologies. SCHOTT often works with its customers and an external network of development partners to develop application-specific and customized solutions.

While developing laser structuring technologies for thin and ultra-thin glass, SCHOTT has already established an ultrasonic lapping process for the coarse structuring of glass wafers with tight tolerances in mass production. 
SCHOTT recently expanded its wafer portfolio to include the photo-structurable glass FOTURAN® II. Compared to the tried and tested predecessor product that has been around for over 30 years, it is characterized by significantly advanced quality, such as material homogeneity. The unique properties of FOTURAN® II wafers enable for example radio frequency (RF) components and microelectromechanical systems (MEMS) by providing high aspect ratio and smallest feature size. FOTURAN® II wafers can be structured and processed in three steps: UV-exposure (with standard lithography equipment, but without the use of photo-resist), tempering, and etching; additional ceramization is also an option when even higher temperature stability is required.

Source: SCHOTT AG